2013-2018 Global and China Advanced Packaging Industry market development potential and investment strategy research report -------------------------------- -------------------------- Report No.: 66307 〖〗: May 2013 〖published]: Beijing Industry Information Research hospital 〖delivery〗: Email electronic version or EMS [Report Price]: [paper version]: 6500 yuan [electronic version]: 6800 yuan [paper + E]: 7000 yuan (price discount) 〖Order〗 Order Fax: 010-57101558 010-52891825 〖〗: 010-84953789 〖straight line phone]: 15001081554 QQ 〖Order〗: 1607366836 〖Contact〗: the Hooley Yang Cheng Kam Lai 〖link〗 http://www.bjcyxxyjy.com / qitaxingye/qita/66307.html [Contents] Chapter I: IC Advanced Packaging Current Situation and 1.1 IC packaging Introduction 1.2 IC Package Type Description 1.2.1 SOP package 1.2.1, QFP and LQFP package 1.2.3, FBGA 1.2.4, TEBGA 1.2.5, FC-BGA 1.2.6, WLCSP 1.2.7, WLCSP Application 1.2.8 Fan-out WLCSP Chapter II, the global semiconductor and China's semiconductor industry 2.1 Industry Overview 2.2, the global semiconductor geographical distribution of 2.3, foundry 2.4, 2.5 semiconductor market in China, China's semiconductor industry, IC packaging and testing industry status quo and 3.1 IC packaging and testing industry status quo 3.2, copper wire 3.3, IC packaging and testing industry horizontal contrast 3.4, state-of-the-art pattern of the packaging industry, advanced packaging downstream market 4.1, advanced packaging market of mobile phone IC 4.2, mobile phone baseband package 4.3, mobile application processor package 4.4 phone transceiver package, mobile phone memory Package 4.5, 4.6, Mobile PA package 4.7, the phone MEMS and other components 4.8, memory areas of advanced packaging 4.9, CPU, GPU and CHIPSET package 4.10 CMOS image sensor package 4.11, the LCD driver IC packaging and testing, advanced packaging manufacturers 5.1, 5.2 super-abundance, FATC 5.3, Powertech 5.4 the ChipMOS Technologies 5.5, King Yuan Electronics 5.6 Amkor 5.7 silicon products Precision 5.8 StatsChipPac 5.9, ASE 5.10, Jing Shuo 5.11, the South circuit board 5.12 Unimicron 5.13, Quanmao, 5.14, IBIDEN 5.15, Shinko Electric 5.16, at Nepes' 5.17, STS Semiconductor 5.18, SEMCO 5.19, Changjiang Electronics Technology 5.20 the Unisem 5.21, Carsem 5.22, Nantong Fujitsu Microelectronics 5.23 Chipbond 1980-2012 IC package development history SOP TSSOP appearance and cross-sectional surface diagram QFP the LQFP HQFP package appearance and cross-sectional schematic the FBGA appearance and cross-sectional schematic FBGA 2006-2012 years roadmap TEBGA the FC-BGA appearance of the appearance of the cross-sectional schematic cross-sectional schematic view of FC-BGA 2006-2012 years development path Figure WL-CSP appearance, manufacturing processes, cross-sectional schematic view of Fan-out the WLCSP development roadmap 2008-2016 Fan-out WLCSP package costs 2012 Fan-out WLCSP packaging capacity of the major manufacturers share 2009-2015 FO-WLP package IC shipments type distribution the 2003-2011 global semiconductor industry output value of 1999 - 2012 quarter 1 quarter of the global IC out volume and the average price in 1998 - 2012 quarter 1 quarter wafer shipments in Q1 2012 Global 2006-2013 Global semiconductor market revenue geographical distribution of the 2005-2014 global foundry industry output value increase in first quarter of 2005 and 2012 a quarter of the global foundry factory average capacity utilization of advanced process wafer industry customer structure 2004 2014 wafer shipments size distribution of the first quarter of 2008 -2011 the fourth quarter of the global foundry capacity utilization in 2005-2009, the size and growth rate of China's IC market sales of product structure of China's IC market in 2009 2010-2012, 2009 China's IC market application structure of China's IC market size and growth forecast for 2008Q1 - 2010Q2 sales of China's IC industry size and growth of the 2007-2012 copper wire penetration 2012 IC packaging and testing industry, geographical distribution of 2009 - 2012 the field of global mobile phone market share of the major manufacturers of advanced packaging 2009-2012 the field of global computer major manufacturers of advanced packaging market share 2009-2012 global memory areas of the major manufacturers of advanced packaging market share 2009-2012 Netcom field of advanced packaging mainly manufacturers market share market share of the global consumer electronics major manufacturers of advanced packaging 2009-2012 2007-2011 2009-2011 Advanced Packaging downstream applications distribution typical phone's internal framework 2007-2012 trend of mobile phone chip memory package SIP phone the memory packaging trends 2007-2011 Pop phone memory trends 2009-2015 Mobile MEMS and sensor usage Elpida Memory roadmap quarter of 2005 - 2009 the manufacturers of the Intel CPU and chipset package orders in the fourth quarter of proportion Toshiba TSV Camera Module 2012 global LCD driver IC packaging and testing (COF / COG) major manufacturers market share in 2012 the market share of the major manufacturers of the world's LCD driver IC Bumping 2008-2011 various LCD driver IC shipments super-abundance income in 2002-2012 the super-abundance income and operating margin and gross margin 2002-2012 January 2008 -2012 in July monthly income of the super-abundance Electronics Statistics 2007 Q1 - 2012 Q1 super-abundance of each quarter revenue and gross margin 2004 - super-abundance of capital expenditure 2007-2012 super-abundance distribution of electronic income type of technology first quarter of 2008 and 2012 a quarter of super-abundance capacity utilization 2002-2012 the FATC revenue and gross margin FATC organizational structure 2002-2012 FATC capital expenditure 2005-2011 Powertech Technology revenue and gross margin 2005-2011 Powertech income and operating margin quarter first quarter of 2008 -2012 force into a monthly income of 2003-2012 2012 capital expenditure Powertech Powertech customer structure 1,1 quarter of 2012 Powertech Technology revenue package type distribution (By Package Type) 2009-2012 force into the production line capacity the 2001-2009 ChipMos income and gross profit statistics 2003-2012 ChipMOS Technologies of quarter of 2012 cash flow of years the ChipMOS Global EBITDA rate ChipMOS Technologies 2006-2009 income product distribution 2006-2009 ChipMOS Technologies income geographical distribution ChipMOS Technologies technical capabilities quarter of 2012 ChipMos income (sub-business departments) 1 quarter of 2012, the ChipMOS Technologies income products distribution 2003-2012 King Yuan Electronics revenue and gross profit margin statistics and forecast 2005-2012, King Yuan Electronics organizational structure, King Yuan Electronics income distribution downstream of the 2005-2012 King Yuan Electronics income Application distribution of the Amkor income 2005-2012 and gross margin, operating margin the Amkor sales in the quarter of 2007-2012, administration, R & D spending a quarter of 2007-2012 Amkor capital expenditure 2007-2009 Amkor income packaging technology distribution in 2008 - 2012 quarter 1 quarter the Amkor income distribution of packaging technology the Q4 2008 -2012 quarter of Amkor shipments packaging technology distribution a quarter of 2005-2012 Amkor CSP package revenue and shipments in the first quarter of 2008 -2012 quarter Amkor CSP package revenue and shipments in Q1 2012 Amkor CSP Package income distribution of downstream applications 2005-2012 Amkor BGA package revenue and shipments in Q1 - 2012 Q1 2008 Amkor BGA package revenue and shipments 1 quarter of 2012, Amkor BGA Package income distribution of downstream applications 2005-2012 quarter the Amkor Leadframe package revenue and shipments in Q1 - 2012 Q1 2008 Amkor Leadframe Package revenue and shipments in the 1 quarter of 2012, Amkor Leadframe Package income quarter of 2005-2012, the distribution of downstream applications Amkor test revenue and shipments in Q1 2008 -2012 Q1 Amkor test revenue and shipments of the 1 quarter of 2012, Amkor Test income downstream applications distributed first quarter of 2008 - 2012 Amkor quarter capacity utilization in the first quarter of 2008 -2012 quarter the Amkor income distribution of downstream applications 1 quarter of 2012, Amkor output value of the geographical distribution of the 1 quarter of 2012, the Amkor production in the geographical distribution of the organizational structure of silicon products the 2003-2012, silicon product revenue, gross margin, operating margin 2001-2012 capital expenditure 2009-2012, silicon products, silicon products 1,1 quarter income geographical distribution 2009-2012 1,1 quarter the silicon product revenue distribution of downstream applications 2009-2012 1,1 silicon quarter product revenue package type distribution of silicone products in January-June 2012 copper wire percentage of revenues 2004-2012 ChipPAC revenue and gross margin 2006-2012 StatsChipPac income Package Type Distribution 2006-2012 StatsChipPac income distribution of downstream applications 2006-2012 ChipPAC downstream of the income of the geographical distribution of revenue and gross margin 2009 Q1 - 2012 Q1 the ASE income, gross margin, operating margin in the organizational structure of ASE ASE 2001-2012 first quarter of 2009 - 1 quarter of 2012, ASE Package revenue, gross margin, operating margin quarter first quarter of 2009 -2012 the ASE package revenue type of technology distribution first quarter of 2009 -2012 quarter ASE test business revenue, gross margin, operating profit rate of 1 quarter of 2012, the ASE income distribution of downstream applications from 2005 to 2011 the ASE income distribution business 2005-2009 ASE income of downstream applications distribution of 2007-2011 to become Shuo income distribution of Package Type 2006-2009 year for the Shuo income distribution of downstream applications 2009 to become Master customer structure quarter of 2012 the Kinsus income product structure 2003-2012 revenue and gross profit margin of Nanya PCB board income in the first quarter of 2009 -2011 the fourth quarter of South Asia 2007-2011 Nanya PCB income product distribution Q1 2009 -2011 fourth quarter of sub-Bu Xin Xing Nan Ya PCB FC Encapsulation proportion of the 1 quarter of 2012, Nan Ya PCB customer structure organizational structure of Xin Xing the 2000-2012 Hin Hing income, with gross margin Xin Xing factory capacity of a variety of products in 2007-2009 Quanmao structure, 2003-2012 Quanmao operating income and gross margin statistics and forecast first quarter of 2008 - 2009 1 quarter Quanmao the mix proportion of the number of layers of the first quarter of 2008 - 2009 1 quarter Quanmao Statistics 2008 1 quarter 1 quarter - 2009 - 2012 Phoenix Precision Technology products downstream applications and the proportion in 2007 Q1 - 2009 Q1 the IBIDEN income and operating margin of the geographical structure of the Phoenix income 2004-2010 fiscal year 2009 fiscal year first quarter fiscal year quarter the Ibiden income and operating margin in fiscal year 2004-2009 IBIDEN income geographical distribution of Shinko Electric income and operating margin of the 2005-2011 fiscal year 2005-2009 fiscal year Shinko Electric assets 2005-2009 fiscal year Shinko Electric Capital Expenditures 2005-2011 fiscal year Shinko Electric income distribution the 2003-2012 Nepes income and operating margin 2007-2012 Nepes income product distribution 2004-2012 STS semiconductor revenue and EBITDA margin 2008-2012 STS semiconductor revenue distribution quarter of 2005 -2012 quarter, Samsung Electro-Mechanics BGA package revenue and operating margin quarter of 2005 -2012 Samsung Electronics FC-BGA Package income and operating margin Samsung Electro-quarter segment revenues of 1,1 quarter of 2012 ACI Samsung Electro-Mechanics 2012 1,1 quarter package distribution of income downstream applications Unisem revenue and gross profit of the 2005-2012 Jiangyin Changjiang Electronics income and operating margin 2004-2012 2006-2011 Nantong Fujitsu Microelectronics income and operating margin-packing type of 2009 Nantong Fujitsu Microelectronics income distribution in 2003 - 2011 Chipbond revenue and gross profit margin quarter of 2012 Chipbond income Package Type Distribution in 2012 Chipbond income customers distribution of the world's largest manufacturers of packaging and testing in 2012 common phone WLCSP package IC use 20 2009-2012 annual income, gross margin package with the 2009-2012 income and an increase of the operating margin 20 of the world's largest manufacturers of packaging and testing phone components Package Type 2000-2015 2013-2018 global mobile phone baseband manufacturers packaging technology development forecast 19 models of typical mobile phone base frequency 2012 the global typical mobile application processor package technology 14 models typical mobile transceiver package Andrew Love, 20 models of typical phone PA Package typical mobile phone the other IC packaging technology FATC production the the Nam Mao M & Memorabilia silicon product first quarter of 2006, 2 in 2007, Q1, 1,1 quarter of 2009 the Capacity Statistics silicon products Suzhou plant production capacity of silicon products copper wire proportion of first quarter of 2012 -2011 4th quarter the ASE production capacity Kinsus in production in the fourth quarter of 2012 Q1 -2011 quarter of 2012 - Nanya PCB capacity in the fourth quarter of 20111 Nanya PCB production capacity of 2006-2009 fiscal year 2007-2012 FC Package income statistics